HI-1573, HI-1574
TRANSMITTER
TXA/B
TXA/B
TXINHA/B
52.5
W
(.75 Zo)
35
W
(.5 Zo)
52.5
W
(.75 Zo)
BUSA/B
1:1.79
Point
“A
T
”
1:1.4
52.5
W
(.75 Zo)
35
W
(.5 Zo)
BUSA/B
Isolation
Transformer
Point
“A
T
”
1.79:1
Coupling
Transformer
52.5
W
(.75 Zo)
1.4:1
RECEIVER
RXA/B
RXA/B
Coupling
Transformer
Isolation
Transformer
RXENA/B
Figure 3. Transformer Coupled Test Circuits
HEAT SINK - ESOIC & CHIP-SCALE
PACKAGE
Both the HI-1573PSI/T/M and HI-1574PSI/T/M use a 20-
pin thermally enhanced SOIC package. The HI-
1573PCI/T and HI-1574PCI/T use a plastic chip-scale
package. These packages include a metal heat sink
located on the bottom surface of the device. This heat
sink should be soldered down to the printed circuit board
for optimum thermal dissipation. The heat sink is
electrically isolated and may be soldered to any
convenient power or ground plane..
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
THERMAL CHARACTERISTICS
PART NUMBER
HI-1573PSI / T / M
HI-1574PSI / T / M
HI-1573CDI / T / M
HI-1574CDI / T / M
HI-1573PCI / T
HI-1574PCI / T
PACKAGE STYLE
CONDITION
Heat sink
unsoldered
Heat sink
soldered
Socketed
Heat sink
unsoldered
Ø
JA
54°C/W
47°C/W
62°C/W
49°C/W
JUNCTION TEMPERATURE
T
A
=25°C
52°C
49°C
56°C
50°C
T
A
=85°C T
A
=125°C
112°C
109°C
116°C
110°C
152°C
149°C
156°C
150°C
20-pin Thermally
enhanced plastic
SOIC (ESOIC)
20-pin Ceramic
side-brazed DIP
44-pin Plastic chip-
scale package
Data taken at VDD=3.3V, continuous transmission at 1Mbit/s, single transmitter enabled.
HOLT INTEGRATED CIRCUITS
6
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
