HI-1570
ORDERING INFORMATION
HI - 1570PS x x (Plastic)
PART
NUMBER
LEAD
FINISH
Blank
F
PART
NUMBER
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free, RoHS compliant)
TEMPERATURE
RANGE
FLOW
BURN
IN
I
T
M
PART
NUMBER
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
I
T
M
NO
NO
YES
RXENA = 0 RXENB = 0 PACKAGE
RXA RXA RXB RXB DESCRIPTION
1570PC
1570PS
0
0
0
0
0
0
0
0
44 PIN PLASTIC CHIP-SCALE LPCC (44PSC)
not available with ‘M’ flow
20 PIN PLASTIC ESOIC, Thermally Enhanced
Wide SOIC with Heat Sink (20HWE)
HI - 1570CD x (Ceramic)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
LEAD
FINISH
I
T
M
PART
NUMBER
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
I
T
M
NO
NO
YES
Gold (Pb-free, RoHS compliant)
Gold (Pb-free, RoHS compliant)
Tin / Lead (Sn / Pb) Solder
RXENA = 0 RXENB = 0 PACKAGE
RXA RXA RXB RXB DESCRIPTION
1570CD
0
0
0
0
20 PIN CERAMIC SIDE BRAZED DIP (20C)
HOLT INTEGRATED CIRCUITS
8
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
