HI-1570
HEAT SINK - ESOIC PACKAGE
The HI-1570PSI/T/M all use a 20-pin thermally enhanced
SOIC package. The package include a metal heat sink
located on the bottom surface of the device. The heat
sink should be soldered down to the printed circuit board
for optimum thermal dissipation. The heat sink is also
electrically isolated and may be soldered to any
convenient power or ground plane.
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
THERMAL CHARACTERISTICS
JUNCTION TEMPERATURE
T
A
=25°C
66°C
61°C
72°C
62°C
T
A
=85°C T
A
=125°C
126°C
121°C
132°C
122°C
166°C
161°C
172°C
162°C
PART NUMBER
HI-1570PSI / T / M
HI-1570PSI / T / M
HI-1570CDI / T / M
HI-1570CDI / T / M
HI-1570PCI / T
HI-1570PCI / T
PACKAGE STYLE
CONDITION
Heat sink
unsoldered
Heat sink
soldered
Socketed
Heat sink
unsoldered
Ø
JA
54°C/W
47°C/W
62°C/W
49°C/W
20-pin Thermally
enhanced plastic
SOIC (ESOIC)
20-pin Ceramic
side-brazed DIP
44-pin Plastic chip-
scale package
Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.
RECOMMENDED TRANSFORMERS
The HI-1570 transceiver has been characterized for
compliance with the electrical requirements of MIL-STD-
1553 when used with the following transformers. Holt
MANUFACTURER
Technoltrol
Premier Magnetics
Technoltrol
Premier Magnetics
recommends the Premier Magnetics parts as offering the
best combination of electrical performance, low cost and
small footprint.
TURNS RATIO(S)
Dual tapped 1:1.79, 1:2.5
Dual tapped 1:1.79, 1:2.5
1:1.4
1:1.4
PART NUMBER
TL1553-45
PM-DB2725EX
TQ1553-2
PM-DB2702
APPLICATION
Isolation
Isolation
Stub coupling
Stub coupling
DIMENSIONS
.630 x .630 x .155 inches
.500 x .500 x .375 inches
.625 x .625 x .250 inches
.625 x .625 x .250 inches
HOLT INTEGRATED CIRCUITS
7
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
