HI-8382, HI-8383
HI-8382 PACKAGE THERMAL CHARACTERISTICS
MAXIMUM ARINC LOAD 7
SUPPLY CURRENT (mA) 2
Ta = 25 oC Ta = 85 oC Ta=125 oC
ARINC 429
DATA RATE
JUNCTION TEMP, Tj (°C)
1
PACKAGE STYLE
Ta = 25 oC
Ta = 85 oC Ta=125 oC
3
Low Speed
17.6
25.4
17.9
25.8
17.2
24.5
17.4
24.8
17.0
24.2
17.1
24.4
48
56
41
47
107
110
103
112
142
150
145
147
28 Lead PLCC
4
High Speed
Low Speed
High Speed
16 Lead Ceramic SB DIP
A OUT and B OUT Shorted to Ground 5, 6, 7
SUPPLY CURRENT (mA) 2
Ta = 25 oC Ta = 85 oC Ta=125 oC
ARINC 429
DATA RATE
JUNCTION TEMP, Tj (°C)
1
PACKAGE STYLE
Ta = 25 oC
Ta = 85 oC Ta=125 oC
3
60.1
63.1
62.1
64.0
55.7
56.3
56.2
56.2
52.4
52.3
53.0
52.2
110
157
150
145
144
194
182
180
176
Low Speed
28 Lead PLCC
4
100
High Speed
Low Speed
High Speed
90
16 Lead Ceramic SB DIP
86
Notes:
1. All data taken in still air on devices soldered to a single layer copper PCB (3" X 4.5" X .062").
2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.
3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.
4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30
as this is considered unrealistic for high speed operation.
5. Similar results would be obtained with AOUT shorted to BOUT.
6. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended .
7. Data will vary d epending on air flow and the method of heat sinking employed.
HI-8383 part numbers identical except the SMD version is not available.
NUMBER
HI-8382C
HI-8382CT
DESCRIPTION
RANGE
FLOW
IN
FINISH
GOLD
GOLD
16 PIN CERAMIC SIDE BRAZED DIP
16 PIN CERAMIC SIDE BRAZED DIP
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
I
NO
NO
T
HI-8382CM-01 16 PIN CERAMIC SIDE BRAZED DIP
HI-8382CM-03* 16 PIN CERAMIC SIDE BRAZED DIP
M
YES SOLDER
-55°C TO +125°C DSCC YES SOLDER
HI-8382J
28 PIN PLASTIC J -LEAD PLCC
-40°C TO +85°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
I
T
I
NO SOLDER
NO SOLDER
HI-8382JT
HI-8382S
HI-8382ST
28 PIN PLASTIC J -LEAD PLCC
28 PIN CERAMIC LEADLESS CHIP CARRIER
28 PIN CERAMIC LEADLESS CHIP CARRIER
NO
NO
GOLD
GOLD
T
M
I
HI-8382SM-01 28 PIN CERAMIC LEADLESS CHIP CARRIER
YES SOLDER
NO SOLDER
NO SOLDER
HI-8382U
32 PIN J-LEAD CERQUAD
32 PIN J-LEAD CERQUAD
HI-8382UT
T
HOLT INTEGRATED CIRCUITS
5
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
