HI-8585 / HI-8586 PACKAGE DIMENSIONS
inches (millimeters)
8-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
Package Type: 8HNE
Top View
Bottom View
.1935 .0035
(4.915 .085)
.0085 .0015
(.2159 .0381)
.140 .010
(3.556 .254)
.236 .008
(5.994 .203)
.1535 .0035
(3.90 .09)
.100 .010
(2.540 .254)
PIN 1
Electrically isolated metal
heat sink on bottom of
package
DETAIL A
.0165 .0035
(.4191 .0889)
(Connect to any ground or
power plane for optimum
thermal dissipation)
.055 .005
(1.397 .127)
0° to 8°
.0025 .0015
(.0635 .0381)
.033 .017
(.8382 .4318)
.050 .010
(1.27 .254)
DETAIL A
8-PIN PLASTIC DIP
Package Type: 8P
.385 ± .015
(4.699 ± .381)
.250 ± .010
(6.350 ± .254)
.100 ± .010
(3.540 ± .254)
.300 ± .010
(7.620 ± .254)
7° TYP.
.025 ± .010
(.635 ± .254)
.135 ± .015
(3.429 ± .381)
.0115 ± .0035
(.292 ± .089)
.1375 ± .0125
(3.493 ± .318)
.055 ± .010
(1.397 ± .254)
.335 ± .035
(8.509 ± .889)
.019 ± .002
(.483 ± .102)
HOLT INTEGRATED CIRCUITS
7
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
