ꢁiscrete Therꢃistꢄrs
173 Series
175 Series
192 Series
Description
EIA 0805 surface mount, end-banded
-60 °C to 125 °C [-76 °F to 257 °F]
EIA 1206 surface mount, end-banded
-60 °C to 125 °C [-76 °F to 257 °F]
3,5 mW/°C
Uni-Curve with bare leads and epoxy
-60 °C to 150 °C [-76 °F to 302 °F]
0,75 mW/°C
Operating temperature range
Dissipation constant in still air 3,5 mW/°C
Time constant in air
10.0 s
10.0 s
15.0 s
500 Ohm, 5,000 Ohm, 10,000 Ohm,
22,000 Ohm, 33,000 Ohm, 47,000 Ohm,
50,000 Ohm, 100,000 Ohm
500 Ohm, 1,000 Ohm, 2,252 Ohm,
3,000 Ohm, 5,000 Ohm, 10,000 Ohm,
30,000 Ohm, 50,000 Ohm, 100,000 Ohm
Nominal resistance
at [25 °F to 77 °F]
5,000 Ohm, 10,000 Ohm, 50,000 Ohm,
100,000 Ohm, 440,000 Ohm
Maximum diameter
Termination material
Lead length
EIA 0805 SMD
solder plated NI barrier
N/A
EIA 1206 SMD
solder plated NI barrier
N/A
2,413 mm [0.095 in]
tinned copper, alloy 180
38,1 mm [1.50 in]
ꢁiscrete Therꢃistꢄrs
194 Series
196 Series
Description
Uni-Curve with insulated leads and epoxy
-60 °C to 150 °C [-76 °F to 302 °F]
chip with silver top and bottom surface electrode
Operating temperature range
-60 °C to 150 °C [-76 °F to 302 °F]
Dissipation constant in still air 0,75 mW/°C
0,75 mW/°C
10 .0 s
Time constant in air
15.0 s
Nominal resistance
at [25 °F to 77 °F]
2,252 Ohm, 3,000 Ohm, 5,000 Ohm, 10,000 Ohm, 30,000
Ohm, 100,000 Ohm, 50,000 Ohm
500 Ohm, 1,000 Ohm, 2,000 Ohm,
5,000 Ohm, 10,000 Ohm, 50,000 Ohm, 100,000 Ohm
Maximum diameter
Termination material
Lead length
2,413 mm [0.095 in]
solid nickel, Teflon insulated
38,1 mm [1.50 in]
2,413 mm [0.095 in]
metalized silver
N/A
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