Soldering
Immerse the pins melt solder
at 260℃+5/-0℃ for 5 sec.
2.4 Mechanical Test
Item
Test condition
Vibration test
600-3300rpm amplitude 1.5mm
3 directions 2 H each
Drop test
On maple plate from 1 m high 3 times
Lead pull test
Pull with 1 kg force for 30 seconds
Lead bend test
90
o
bending with 500g weigh 2 times
2.5 Voltage Discharge Test
Item
Test condition
Surge test
Between any two electrode
More then 95% of total
area of the pins should
be covered with solder
Allowable change of absolute
Level at center frequency(dB)
<1.0
<1.0
<1.0
<1.0
Allowable change of absolute
Level at center frequency(dB)
<1.0
3
HOPERF [ Hope Microelectronics co., Ltd ]
