1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that a
0.10 mm (0.004 inches) thick
stencil be used for solder paste
printing. Aperture opening for
shield pad is 0.6 mm x 0.6 mm.
This is to ensure adequate
printed solder paste volume and
no shorting.
APERTURE OPENING
0.1
1.65
2.2
UNIT: mm
Figure 10. Solder stencil aperture.
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space
occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
Note:
Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
MOUNTING
CENTER
2.65
3.2
UNIT: mm
0.2 MIN.
Figure 11. Adjacent land keepout and solder mask areas.
11
HP [ AGILENT(HEWLETT-PACKARD) ]
