5
Small-Outline SO-8 Package (HCPL-070A, HCPL-073A)
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.270 BSG
(0.050)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
0.432
(0.017)
45° X
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
Solder Reflow Temperature Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
Figure 1. Solder Reflow Thermal Profile (HCPL-070A, HCPL-073A, and Gull Wing
Surface Mount Option 300 Parts).
HP [ AGILENT(HEWLETT-PACKARD) ]
