3
Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
16
V
CC
15
V
O1
14
V
O2
13
V
O3
12
V
O4
11
GND 10
9
20 Pad LCCC
Surface Mount
2 Channels
15
V
CC2
19
20
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
1
2
3
4
V
CC
V
O
8
7
6
5
1
2
3
4
V
CC
V
O1
8
7
2
3
4
V
O2
V
E
GND
6
5
5
6
7
8
2
3
10
GND
Note:
Multichannel DIP and flat pack devices have common V
CC
and ground. Single channel DIP has an enable pin 6. LCCC (leadless
ceramic chip carrier) package has isolated channels with separate V
CC
and ground connections.
Outline Drawings
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.85 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.02 (0.355)
8.76 (0.345)
0.31 (0.012)
0.23 (0.009)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
HP [ AGILENT(HEWLETT-PACKARD) ]
