Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
20 Pad LCCC
Surface Mount
2 Channels
15 14
1
V
16
1
16
B1
V
V
B2
CC2
1
V
8
1
V
8
CC
CC
19
20
13
12
2
3
4
V
15
14
13
2
3
4
V
15
14
13
V
OC1
CC
O2
V
V
O1
O2
2
3
4
V
B
7
6
5
2
3
4
7
6
5
GND
2
V
V
V
V
V
O1
O1
O2
O3
O4
V
OUT
V
CC1
2
3
10
9
V
O1
GND
V
B1
GND
1
GND
GND
5
12
V
5
12
B2
7
8
V
6
7
8
11
10
9
6
7
8
11
10
9
CC2
GND
GND
V
O2
Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages
have isolated channels with separate VCC and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
8.13 (0.320)
MAX.
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Leaded Device Marking
Leadless Device Marking
HP LOGO
HP P/N
DESC SMD*
DESC SMD*
PIN ONE/
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
* 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
HP LOGO
HP P/N
PIN ONE/
HP QYYWWZ
XXXXXX
* XXXX
XXXXXX
USA 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DESC SMD*
DESC SMD*
HP FSCN*
COUNTRY OF MFR.
HP FSCN*
ESD IDENT
COUNTRY OF MFR.
ESD IDENT
* QUALIFIED PARTS ONLY
*QUALIFIED PARTS ONLY
*QUALIFIED PARTS ONLY
1-561
HP [ HEWLETT-PACKARD ]
