6
Absolute Maximum Ratings
Storage Temperature Range, TS .................................. -65°C to +150°C
Operating Temperature, TA ......................................... -55°C to +125°C
Case Temperature, TC ............................................................... +170°C
Junction Temperature, TJ ......................................................... +175°C
Lead Solder Temperature ................................................ 260°C for 10s
Output Current, IO (Each Channel)..............................................40 mA
Output Voltage, VO (Each Channel) .................................-0.5 to 20 V[1]
Supply Voltage, VCC ..........................................................-0.5 to 20 V[1]
Output Power Dissipation (Each Channel) ............................. 50 mW[2]
Peak Input Current (Each Channel, <1 ms Duration) .................20 mA
Average Input Current, IF (Each Channel)............................... 10 mA[3]
Reverse Input Voltage, VR (Each Channel).........................................5V
Package Power Dissipation, PD (each channel) ........................200 mW
8 Pin Ceramic DIP Single Channel Schematic
V
8
CC
I
I
CC
F
2
+
ANODE
V
F
I
–
3
O
6
5
CATHODE
V
O
GND
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5700/01/0K and 6730/31/3K .................................. (∆∆), Class 2
6N140A, 6N140A/883B, HCPL-177K,
HCPL-6750/51/5K and HCPL-5730/31/3K................ (Dot), Class 3
Recommended Operating Conditions
Parameter
Input Voltage, Low Level (Each Channel)
Input Current, High Level (Each Channel)
Supply Voltage
Symbol
VF(OFF)
IF(ON)
VCC
Min.
Max.
0.8
5
18
18
Units
V
mA
V
0.5
2.0
2.0
Output Voltage
VO
V
HP [ HEWLETT-PACKARD ]
