Solder Reflow Temperature Profile (Gull Wing Surface Mount Option 300 Parts)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
The HCPL-2602/2612 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking
Path (External Creepage)
Min. Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
Symbol
L(I01)
L(I02)
Value
7.1
7.4
0.08
Units
mm
mm
mm
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
CTI
200
V
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
1-318
HP [ AGILENT(HEWLETT-PACKARD) ]
