Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
20 Pad LCCC
Surface Mount
2 Channels
15
V
CC2
19
7
V
O2
6
5
1
2
3
4
V
CC
V
E
8
7
6
5
1
2
3
4
V
CC
V
O1
8
V
O2
GND
2
V
O1
GND
1
7
8
V
CC1
13
12
20
V
O
GND
2
3
10
GND
Note:
All DIP devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with
separate V
CC
and ground connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
1-526
HP [ AGILENT(HEWLETT-PACKARD) ]
