Package
The outer housing including
the duplex SC connector or
the duplex ST ports is molded
of filled nonconductive plastic
to provide mechanical strength
and electrical isolation. The
solder posts of the Agilent
design are isolated from the
circuit design of the
The transceiver is attached to
a printed circuit board with
the nine signal pins and the
two solder posts which exit
the bottom of the housing. The
two solder posts provide the
primary mechanical strength to
withstand the loads imposed
on the transceiver by mating
with duplex or simplex SC or
ST connectored fiber cables.
The overall package concept
for the Agilent transceivers
consists of three basic
elements; the two optical
subassemblies, an electrical
subassembly and the housing
as illustrated in Figure 1 and
Figure 1a.
transceiver and do not require
connection to a ground plane
on the circuit board.
The package outline drawing
and pin out are shown in
Figures 2, 2a and 3. The
details of this package outline
and pin out are compliant
with the multisource definition
of the 1 x 9 SIP. The low
profile of the Agilent
transceiver design complies
with the maximum height
allowed for the duplex SC
connector over the entire
length of the package.
ELECTRICAL SUBASSEMBLY
DUPLEX SC
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
QUANTIZER IC
DETECT OUT
PREAMP IC
OPTICAL
SUBASSEMBLIES
The optical subassemblies
DIFFERENTIAL
DATA IN
LED
utilize a high volume assembly
process together with low cost
lens elements which result in a
cost effective building block.
DRIVER IC
The electrical subassembly
consists of a high volume
multilayer printed circuit
board on which the IC chips
and various surface-mounted
passive circuit elements are
attached.
TOP VIEW
Figure 1. SC Connector Block Diagram
ELECTRICAL SUBASSEMBLY
DUPLEX ST
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
The package includes internal
shields for the electrical and
optical subassemblies to ensure
low EMI emissions and high
immunity to external EMI
fields.
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1a. ST Connector Block Diagram.
2
HP [ HEWLETT-PACKARD ]
