Board Layout - Art Work
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
The second case to consider is
static discharges to the exterior
of the equipment chassis con-
taining the transceiver parts. To
the extent that the MT-RJ
connector is exposed to the
outside of the equipment chassis
it may be subject to whatever
ESD system level test criteria
that the equipment is intended
to meet.
The Applications Engineering
group has developed a Gerber
file artwork for a multilayer
printed circuit board layout
incorporating the recommenda-
tions above. Contact your local
Agilent sales representative for
details.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal
ESD handling precautions for
ESD sensitive devices. These
pre-cautions include using
grounded wrist straps, work
benches, and floor mats in ESD
controlled areas.
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with
the various international
regulations governing certifica-
tion of Information Technology
Equipment. See the Regulatory
Compliance Table for details.
Additional information is
available from your Agilent sales
representative.
7.11
(0.2ꢀ)
3.56
(0.14)
Ø 1.4 0.1
(0.055
0.004)
Ø 1.4 0.1
(0.055
0.004)
Holes For
Housing
Leads
KEEP OUT AREA
FOR PORT PLUG
7
Ø 1.4 0.1
(0.055
0.004)
(0.276)
10.16
(0.4)
10.ꢀ
(0.425)
13.97
(0.55)
MIN.
3.0ꢀ
(0.121)
13.34 7.59
9.59
(0.37ꢀ)
2
(0.525) (0.299)
(0.079)
1.77ꢀ
(0.07)
Ø 2.29
(0.09)
3
3
(0.11ꢀ)
(0.11ꢀ)
4.57
(0.1ꢀ)
Ø 0.ꢀ1 0.1
(0.032 0.004)
7.112
(0.2ꢀ)
6
(0.236)
17.7ꢀ
(0.7)
27
(1.063)
3.0ꢀ
(0.121)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE MT-RJ TRANSCEIVER PLACED
AT .550 SPACING.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AREAS.
3. 10 PIN MODULE REQUIRES ONLY 16 PCB HOLES, INCLUDING 4 PACKAGE GROUNDING TAB HOLES CONNECTED
TO SIGNAL GROUND.
4. THE SOLDER POSTS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
Figure 9. Recommended Board Layout Hole Pattern
8
HP [ HEWLETT-PACKARD ]
