0.5
1.0
DELTA V
F
(NORMALIZED AT 25°C)
0.4
NORMALIZED INTENSITY
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-100
InGaN/GaN
-50
0
50
100
150
GaP/AlGaAs/
AlInGaP
0.8
0.6
0.4
0.2
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
TEMPERATURE – °C
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
10 to 20 SEC.
217 °C
TEMPERATURE
+5 °C
255 °C
-0 °C
6 °C/SEC. MAX.
20 SEC. MAX.
TEMPERATURE
240°C MAX.
3°C/SEC. MAX.
100-150°C
3°C/SEC.
MAX.
120 SEC. MAX. 60-150 SEC.
3 °C/SEC. MAX.
125 °C ± 25 °C
183°C
–6°C/SEC.
MAX.
MAX. 120 SEC.
60 to 150 SEC.
TIME
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 8a. Recommended SnPb reflow soldering profile.
Figure 8b. Recommended Pb-free reflow soldering profile.
4.50
1.50
TURBULENT WAVE
250
TEMPERATURE –
°C
LAMINAR WAVE
HOT AIR KNIFE
2.60
200
150
FLUXING
100
50
30
0
10
BOTTOM SIDE
OF PC BOARD
PREHEAT
TOP SIDE OF
PC BOARD
20
30
40
50
60
70
80
90
TIME – SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
Figure 9. Recommended wave soldering profile.
9
;; ;;;
;;
;;
;;
100
SOLDER RESIST
Figure 10. Recommended soldering pad pattern.
HP [ AGILENT(HEWLETT-PACKARD) ]
