BUsage
Recommendations
1. Recommended temperature profile
(Temperature)
250ç
200ç
150ç
100ç
60 to 120 sec.
Reflow Conditions
Preheating: 150ç to 170ç 60 to 120 sec.
Soldering: 245±5ç
220ç
10 sec. max.
60 sec. max.
10 sec. max
250ç max.
220
ç
60 sec. max.
50ç
0ç
0 sec.
50 sec.
100 sec.
150 sec. (Time)
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is
a return to normal temperature between the first and second cycle.
Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the
connector terminals.
2. Recommended manual soldering
3. Recommended screen thickness and
open area ratio (Pattern area ratio)
4.Board warpage
5.Cleaning conditions
6. Precautions
Manual soldering: 290±10ç for 3 seconds
Thickness: 0.12 mm
Opening are ratio: DS side 100%, DP side 84%
Maximum of 0.02 mm at the connector center, with both ends of the connector as reference points.
Refer to "Nylon Connector Use Handbook".
s
Due to the extremely small size of the connectors, handling it with bare hands should
be avoided. Follow the recommendations given on the proceeding pages.
s
Use of fluxes is NOT recommended.
s
Different production lots may exhibit some discoloration of the insulator material. This
will not affect form, fit or function of the connectors.
s
The connectors should not be used a sole PCB support. It is recommended to use
additional means of board support.
9
HRS [ HIROSE ELECTRIC ]
