BEmbossed
Carrier Tape Dimensions
Unit: mm
Product Type
Size
Number of Contacts
2
to
4
DF3/3D-*P-2H
5
to
7
8
to
12
13
to
15
A
24
32
44
56
B
–––
28.4
40.4
52.4
C
11.5
14.2
20.2
26.2
D
24.4
32.4
44.4
56.4
BPrecautions
1. Recommended Temperature Profile (SMT)
Note1: Maximum twice action is allowed under the same condition. However, the interval between
the first and second actions must be maintained at room temperature.
Note2: The temperature indicates the board surface temperature on the connector lead area.
2. Recommended Manual Soldering Condition (SMT) Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds
3. Recommended Screen Thickness (SMT) 0.15
to
0.2mm
4. Board Warpage (SMT)
5. Recommended Soldering Condition (DIP)
6. Cleaning Condition
7. Connection Condition
Based on both connector edges, 0.03mm max. in the connector center portion
sFlow
Condition with Automatic Soldering Tool. Soldering temperature: 250±5ç, Soldering time: Within 3 seconds
sManual
Soldering Condition. Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds
Refer to the "Nylon Connector Use Hand book".
Refer to the "Nylon Connector Use Hand book".
A265