BPrecautions
for Use
1. Recommended Temperature Profile (SMT)
Temperature
IR reflow condition
Preheating area 150ç
Soldering area
for 100 to 120 seconds
Maximum
235±5ç for 10 seconds max.
220ç
Min for 10 to 30 second
Preheating area
Soldering area
Time
Note 1 : Maximum twice action is allowed under the same condition. However, the interval between
the first process and second actions must be maintained at the room temperature.
Note 2 : The temperature indicates the board surface temperature in the connector lead area.
2. Recommended Manual Soldering Condition (SMT)
3. Recommended Screen Thickness (SMT)
4. Board Warp(SMT)
5. Cleaning Condition
6. Cautions
Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds
0.15mm
Maximum 0.03mm in the connector center area, based on both connector edges.
Refer to the "Nylon Connector Use Hand book".
s
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
s
Where the board is not mounted, the insertion or extraction will cause damage or deformation in contacts.
s
Excessive scoop insertion or extraction may result in damage.
s
In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.
s
The color phase of this product may be slightly different from that of the forming product according to the
manufacturing lot. However, the difference doesn't affect the performance.
A285
HRS [ HIROSE ELECTRIC ]
