B
Recommended Temperature Profile
[For FH19 & FH19S Series]
q
Using Typical Solder Paste
5 sec. Max.
250
240ç
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-2)
Environment
:Room air
:Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s Part
Number: OZ63-201C-50-9)
:Glass epoxy 45mm∞100mm∞1.6mm thick
:0.3mm∞0.8mm
:0.25mm∞0.8mm∞0.1mm thick
Solder composition
Temperature(ç)
200
200ç
150
160ç
150ç
100
Test board
Land dimensions
Metal mask
50
25ç
0
Start
60
Preheating
120
Soldering
(60 sec.)
(30 sec.) (20 sec.
to 30 sec.)
60 sec. to 90 sec.
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
Time (Seconds)
q
Using Lead-free Solder paste
MAX 250ç
250
230ç
200
Temperature(ç)
200ç
HRS test condition
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-2)
:Room air
:Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s Part
Number:M705-221CM5-42-10.5)
Test board
Land dimensions
Metal mask
:Glass epoxy 45mm∞100mm∞1.6mm thick
: 0.3mm∞0.8mm
:0.25mm∞0.8mm∞0.1mm
Environment
Solder composition
150
150ç
100
50
25ç (60 sec.)
0
Start
60 Preheating 120
Time (Seconds)
Soldering
90 sec. to 120 sec.
(60 sec.)
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult tour solder paste and equipment
manufacturer for specific recommendations.
45
HRS [ HIROSE ELECTRIC ]
