BRecommended
Temperature Profile
Temperature (ç)
10 sec.max.
240
200
160
150
Using Typical Solder Paste
q
Maximum temperature
w
Peak temperature time
e
Peak temperature
r
200ç min.
t
150ç to 160ç
Metal mask thickness
Reflow cycles
40 sec.min.
50 sec.max.
Time (sec.)
: 240ç
: 10 sec. max.
: 220ç to 235ç
: 50 sec. max.
: 40 sec. min.
: 0.12 mm
: 2 cycles
100
50
0
Temperature (ç)
250
230
200
180
160
150
10 sec.max.
Using Lead-free Solder paste
q
Maximum temperature
w
Peak temperature time
e
Peak temperature
r
230ç min.
t
150ç to 180ç
Metal mask thickness
Reflow cycles
: 250ç
: 10 sec. max.
: 245ç to 250ç
: 30 sec. max.
: 60 sec. min.
: 0.12 mm
: 2 cycles
100
50
0
60 sec.min.
30 sec.max.
Time (sec.)
BPrecautions
1. Care should be taken to avoid accumulation of moisture inside the mounted receptacle after the washing
process.
2. This product is intended to be used for circuit inspection only. Consult factory if any other application is
considered.
3. The corresponding plug should be inserted in direction perpendicular to the switch mounting surface,
within an angle of 2°. The push-in force should be kept within 6-10 N.
4. Do not use hand soldering for mounting on the board. Doing so could result in solder and flux wicking to
the contact portion.
5. When using a heat gun, hotplate, or similar methods, limit the temperature to 260ç applied for 10
seconds max.
6. Consult Hirose if your application, installation methods or end-user environment are different than the
recommended.
®
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933
http://www.hirose.com
8
The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements.
HRS [ HIROSE ELECTRIC ]
