HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
M
A
F
C
G
1
2
3
Date Code
Spec. No. : MOS200501
Issued Date : 2005.01.01
Revised Date : 2005.09.28
Page No. : 3/5
Marking:
a1
Pb Free Mark
Pb-Free: "
.
"
(Note)
H
Normal: None
J
0 1 N 6 0 S
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
N
H
a5
L
a2
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
C
F
G
H
L
M
N
a1
a2
a5
Min.
6.35
4.80
1.30
5.40
2.20
0.40
2.20
0.90
0.40
-
0.65
Max.
6.80
5.50
1.70
6.25
3.00
0.90
2.40
1.50
0.65
*2.30
1.05
*: Typical, Unit: mm
a1
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
A
B
C
D
a1
E
Marking:
M
F
y1
a1
Pb-Free: "
.
"
(Note)
H
Normal: None
Pb Free Mark
J
0 1 N 6 0 S
Control Code
Date Code
GI
y1
y1
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
K
a2
y2
H
N
L
a2
y2
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
a1
O
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
a1
a2
y1
y2
Min.
6.40
-
5.04
-
0.40
0.50
5.90
2.50
9.20
0.60
-
0.66
2.20
0.70
0.82
0.40
2.10
-
-
Max.
6.80
6.00
5.64
*4.34
0.80
0.90
6.30
2.90
9.80
1.00
0.96
0.86
2.40
1.10
1.22
0.60
2.50
5
o
3
o
*: Typical, Unit: mm
H01N60SI, H01N60SJ
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
