Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 3/3
HI-SINCERITY
MICROELECTRONICS CORP.
DO-41 Dimension
E
A
B
C
D
DO-41 Molded Plastic Package
HSMC Package Code: L
*: Typical
Inches
Min. Max.
0.0280 0.0340
1.0000
0.1600 0.2050
Millimeters
DIM
Inches
Millimeters
DIM
Min.
0.71
Max.
0.86
-
Min.
1.0000
Max.
-
Min.
25.40
2.00
Max.
-
2.70
A
B
C
D
E
-
25.40
4.10
0.0800 0.1070
5.20
Notes: 1.Dimension and tolerance based on our Spec. dated May 28,1998.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H1N5817, H1N5818, H1N5819
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
