Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 4/5
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
DIM
A
B
C
D
G
H
J
K
L
S
V
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
Marking:
A
Series Code
L
(See Page 1)
A 6
Pb Free Mark
3
(Note)
Pb-Free: "
"
Normal: None
B S
1
2
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
V
G
Pin Style: 1.Base 2.Emitter 3.Collector
Material:
*: Typical, Unit: mm
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
C
D
H
K
J
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HUN21XX Series
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
