3.0A Ultra Low Dropout Linear Regulator
Characteristic
Maximum Allowable Power Dissipation at T
A
=25°C / SOP8-PP
Maximum Allowable Power Dissipation at T
A
=25°C / TO252
Maximum Allowable Power Dissipation at T
A
=25°C / TO263
Maximum Allowable Power Dissipation at T
A
=25°C / TO220
TJ3966
Symbol
Rating
0.571
0.952
1.250
Unit
W
W
W
P
DMax -SOP8-PP
P
DMax -TO252
P
DMax -TO263
P
DMax -TO220
1.429
W
- Please note that above maximum allowable power dissipation is based on the minimum copper
plane area which does not exceed the proper footprint of the package. And the ambient
temperature is
25°C.
If proper cooling solution such as heat sink, copper plane area, air flow is applied, the maximum
allowable power dissipation could be increased. However, if the ambient temperature is increased, the
allowable power dissipation would be decreased.
For example, in case of TO263 package,
θ
JA-TO263
is 80 °C/W, however, as shown in below graph,
θ
JA
could be decreased with respect to the copper plane area. So, the specification of maximum power
dissipation for an application is fixed, the proper copper plane area could be estimated by following
graphs. As shown in graph, wider copper plane area leads lower
θ
JA
.
The maximum allowable power dissipation is also influenced by the ambient temperature. With the
above
θ
JA
-Copper plane area relationship, the maximum allowable power dissipation could be evaluated
with respect to the ambient temperature. As shown in graph, the higher copper plane area leads
θ
JA
.
And the higher ambient temperature leads lower maximum allowable power dissipation.
Aug. 2010 - Rev. 1.7.1
-
10
-
HTC
HTC [ HTC KOREA TAEJIN TECHNOLOGY CO. ]
