1.5A Ultra Low Dropout Linear Regulator
Characteristic
Thermal Resistance Junction-To-Ambient / MSOP8
Thermal Resistance Junction-To-Ambient / SOP8
Thermal Resistance Junction-To-Ambient / SOP8-PP
Thermal Resistance Junction-To-Ambient / SOT223
Thermal Resistance Junction-To-Ambient / TO252
Thermal Resistance Junction-To-Ambient / TO263
Thermal Resistance Junction-To-Ambient / TO220
Thermal Resistance Junction-To-Ambient / SOT89
TJ3965
Symbol
Rating
220
165
175
140
105
80
70
200
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
θ
JA-MSOP8
θ
JA-SOP8
θ
JA-SOP8-PP
θ
JA-SOT223
θ
JA-TO252
θ
JA-TO263
θ
JA-TO220
θ
JA-SOT89
In case that there is no cooling solution and no heat sink / copper plane area for heat sink, the maximum
allowable power dissipation of each package is as follow;
Characteristic
Maximum Allowable Power Dissipation at T
A
=25°C / MSOP8
Maximum Allowable Power Dissipation at T
A
=25°C / SOP8
Maximum Allowable Power Dissipation at T
A
=25°C / SOP8-PP
Maximum Allowable Power Dissipation at T
A
=25°C / SOT223
Maximum Allowable Power Dissipation at T
A
=25°C / TO252
Maximum Allowable Power Dissipation at T
A
=25°C / TO263
Maximum Allowable Power Dissipation at T
A
=25°C / TO220
Maximum Allowable Power Dissipation at T
A
=25°C / SOT89
Symbol
P
DMax-MSOP8
P
DMax -SOP8
P
DMax -SOP8-PP
P
DMax -SOT223
P
DMax -TO252
P
DMax -TO263
P
DMax -TO220
Rating
0.455
0.606
0.571
0.714
0.952
1.250
1.429
Unit
W
W
W
W
W
W
W
P
DMax –SOT89
0.500
W
- Please note that above maximum allowable power dissipation is based on the minimum copper
plane area which does not exceed the proper footprint of the package. And the ambient
temperature is
25°C.
If proper cooling solution such as heat sink, copper plane area, air flow is applied, the maximum
allowable power dissipation could be increased. However, if the ambient temperature is increased, the
allowable power dissipation would be decreased.
For example, in case of SOT223 and TO263 package,
θ
JA-SOT223
is 140 °C/W and
θ
JA-TO263
is 80 °C/W,
however, as shown in below graph,
θ
JA
could be decreased with respect to the copper plane area. So,
the specification of maximum power dissipation for an application is fixed, the proper copper plane area
could be estimated by following graphs. As shown in graph, wider copper plane area leads lower
θ
JA
.
Jul. 2010 – Rev. 1.12
-
11
-
HTC
HTC [ HTC KOREA TAEJIN TECHNOLOGY CO. ]
