GBJ15005 thru GBJ1510
GLASS PASSIVATED
BRIDGE RECTIFIERS
FEATURES
●
Rating to 1000V PRV
●
Ideal for printed circuit board
●
Low forward voltage drop,high current capability
●
Reliable low cost construction utilizing molded plastic
REVERSE VOLTAGE
FORWARD CURRENT
GBJ
? .134(3.4)
? .122(3.1)
1.193(30.3)
1.169(29.7)
- 50
to
1000Volts
- 15
Amperes
.189(4.8)
.173(4.4)
.150(3.8)
.134(3.4)
.198
(5.1)
.800(20.3)
.776(19.7)
? .134(3.4)
? .122(3.1)
technique results in inexpensive product
●
The plastic material has UL flammability
.094(2.4)
.078(2.0)
.043(1.1)
.035(0.9)
.165(4.2)
.142(3.6)
.708(18.0)
.669(17.0)
.106(2.7)
.096(2.3)
+
_
~ ~
.441(11.2)
.425(10.8)
classification 94V-0
.114(2.9)
.098(2.5)
.402(10.2) .303(7.7).303(7.7)
SPACING
.386(9.8) .287(7.3).287(7.3)
.031(0.8)
.023(0.6)
Dimensions in inches and (milimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward (with heatsink Note 2)
Rectified Current
@ T
C
=100℃ (without heatsink)
Peak Forward Surage Current
8.3ms Single Half Sine-Wave
Super Imposed on Rated Load (JEDEC Method)
Maximum Forward Voltage at 7.5A DC
Maximum DC Reverse Current
at Rated DC Blocking Voltage
I
2
t Rating for Fusing (t<8.3ms)
Typical Junction Capacitance Per Element (Note1)
Typical Thermal Resistance (Note2)
Operating Temperature Range
Storage Temperature Range
@ T
J
=25℃
@ T
J
=125℃
SYMBOL
V
RRM
V
RMS
V
DC
I
(AV)
GBJ
15005
50
30
50
GBJ
1501
100
70
100
GBJ
1502
200
140
200
GBJ
1504
400
280
400
15.0
3.2
240
1.1
10.0
500
240
60
0.8
-55 to +150
-55 to +150
GBJ
1506
600
420
600
GBJ
1508
800
560
800
GBJ
1510
1000
700
1000
UNIT
V
V
V
A
I
FSM
V
F
I
R
I
2
t
C
J
R
θJC
T
J
T
STG
A
V
uA
A
2
s
pF
℃/W
℃
℃
NOTES: 1.Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2.Device mounted on 300mm*300mm*1.6mm cu plate heatsink.
~ 319 ~
HY [ HY ELECTRONIC CORP. ]
