GM76U256C Series
MARKING INFORMATION
Package
Marking Example
H
Y
M
y
U
7
N
6
D
U
A
2
I
G
5
6
C
c
c
-
s
s
t
PDIP
y
w
w
K
O
R
E
A
H
Y
M
y
U
7
N
6
D
U
A
2
I
G
5
6
C
E
c
c
F
W
s
s
t
SOP
y
w
w
K
O
R
A
H
Y
M
y
U
7
N
6
D
U
A
2
I
G
5
6
C
E
c
c
T
s
s
t
TSOP-I
y
w
w
K
O
R
A
Index
• HYUNDAI
• KOREA
• GM76U256C
• cc
: Hynix Logo
: Origin Country
: Part Name
: Power Consumption
- L
- LL
: Low Power
: Low Low Power
Blank / FW / T
•
•
: Package Type
- Blank
- FW
: DIP
: SOP
: TSOP-I
- T
ss
: Speed
- 10
: 100ns
: 150ns
- 12
• t
: Temperature
- Blank
- E
: Commercial ( 0 ~ 70 °C )
: Extended ( -25 ~ 85 °C )
yy
ww
•
•
: Year ( ex : 00 = year 2000, 01 = year 2001 )
: Work Week ( ex : 12 = ww12 )
Note
- Capital Letter
: Fixed Item
- Small Letter
: Non-fixed Item
Rev 02 / Apr. 2001
10
HYNIX [ HYNIX SEMICONDUCTOR ]
