目录
v
6.10.2.4 SRAM多周期写................................. 6-30访问
6.10.3 MEM2阅读与等待引脚接入......................................... 6-31 .....
6.10.4 I / O读取访问.......................................... .................................... 6-32
6.10.5 I /带O读访问等待引脚....................................... ............. 6-33
6.10.6 I / O写入访问.......................................... ................................... 6-34
6.10.7 DRAM .............................................. ............................................... 6-35
6.10.7.1快速页模式DRAM访问..................................... 6-35
6.10.7.2 EDO DRAM的单周期................................. 6-36访问
6.10.7.3 EDO DRAM的多周期访问.................................. 6-37
6.10.7.4 DRAM刷新（ CAS前RAS刷新.................... 6-38
6.10直流特性............................................... ........................................ 6-39
7.机械数据
GMS30C2232 ， 160引脚MQFP -包.......................................... ............. 7-1
7.1.1引脚配置 - 查看从顶面........................................ 7-1 ....
7.1.2针交叉参考由引脚名称......................................... ............. 7-2
7.1.3针交叉参考按地点.......................................... .............. 7-3
7.2
GMS30C2232 ， 144引脚TQFP -包.......................................... .............. 7-4
7.2.1引脚配置 - 查看从顶面........................................ 7-4 ....
7.2.2针交叉参考由引脚名称......................................... ............. 7-5
7.2.3针交叉参考按地点.......................................... .............. 7-6
7.3
GMS30C2216 ， 100引脚TQFP -包.......................................... .............. 7-7
7.3.1引脚配置 - 查看从顶面........................................ 7-7 ....
7.3.2针交叉参考由引脚名称......................................... ............. 7-8
7.3.3针交叉参考按地点.......................................... .............. 7-9
7.4 Package-Dimensions...................................................................................... 7-10
附录。指令集详细
7.1
HYNIX [ HYNIX SEMICONDUCTOR ]
