ICS673-01
PLL Building Block
Package Outline and Package Dimensions
(
For current dimensional specifications, see JEDEC Publication No. 95.)
16 pin SOIC narrow
Symbol
A
A1
E
INDEX
AREA
H
B
C
1
2
D
A1
e
C
h x 45°
D
E
e
H
h
L
Inches
h
Min
Max
0.0532
0.0688
0.0040 0.0098
0.0130
0.0200
0.0075 0.0098
0.3859
0.3937
0.1497
0.1574
.050 BSC
S
0.2284
0.2440
0.0099
0.0195
0.0160
0.0500
Millimeters
m
Min
Max
1.35
1.75
0.10
0.24
0.33
0.51
0.19
0.24
9.80
10.00
3.80
4.00
1.27 BSC
S
5.80
6.20
0.25
0.50
0.41
1.27
A
L
B
Ordering Information
Part/Order Number
ICS673M-01
ICS673M-01T
ICS673M-01I
ICS673M-01IT
Marking
ICS673M-01
ICS673M-01
ICS673M-01I
ICS673M-01I
Shipping packaging
tubes
tape and reel
tubes
tape and reel
Package
16 pin SOIC
16 pin SOIC
16 pin SOIC
16 pin SOIC
Temperature
0 to 70 °C
0 to 70 °C
-40 to 85 °C
-40 to 85 °C
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorpor ated (ICS) assumes no responsibility for either its
use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is
intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does
not authorize or warrant any ICS product for use in life support devices or critical medical instruments.
9
Revision 022500
Printed 11/15/00
Integrated Circuit Systems, Inc. • 525 Race Street • San Jose • CA • 95126•(408)295-9800tel • www.icst.com
MDS 673-01 D
ICS [ INTEGRATED CIRCUIT SYSTEMS ]
