IL1117-xx
Figure 5. Best Load Regulation Using Adjustable Output Regulator
Thermal Protection
IL1117 has thermal protection which limits junction temperature to 150°C. However, device functionality is
only guaranteed to a maximum junction temperature of +125°C. The power dissipation and junction tem-
perature for IL1117 in DPAK package are given by
Note: T
JUNCTION
must not exceed 125°C
Current Limit Protection
IL1117 is protected against overload conditions. Current protection is triggered at typically 1.6A.
Thermal Consideration
The IL1117 series contain thermal limiting circuitry designed to protect itself from over-temperature condi-
tions. Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As
mention in thermal protection section, we need to consider all sources of thermal resistance between junc-
tion and ambient. It includes junction-tocase, case-to-heat-sink interface, and heat sink thermal resistance
itself.
Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below
the die. Proper mounting is required to ensure the best possible thermal flow from this area of the package
to the heat sink. The case of all devices in this series is electrically connected to the output. Therefore, if the
case of the device must be electrically isolated, a thermally conductive spacer is recommended.
Rev. 02
IKSEMICON [ IK SEMICON CO., LTD ]
