ILE4275
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Junction temperature
Storage temperature
Input voltage
Min.
Max.
Unit
ТJ
Тstg
VI
-40*
-50
-42
150
150
45
oC
oC
V
VD
ID
VR
IRO
VQ
Reset delay pin voltage
Reset delay pin current
Reset pin voltage
Reset pin current
Output voltage
-0.3**
-2
-0,3**
-5
7**
2
25**
5
V
mA
V
mA
V
-1,0**
16**
_________
* Ambient temperature is indicated.
** Voltage is not applied to input I
* Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those in-
dicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 3. Recommended Operation Rate
Symbol
Parameter
Junction temperature
Min.
Max.
Unit
oC
V
ТJ
VI
-40*
5,6
150
40
Input voltage
VQ
Output voltage
4,9
5,1
V
Note:
Maximum power Ptot,W, dissipated by IC at ambient temperature TA , is calculated by formula:
Ptot = (150 - TA) / Rth j-a
,
(1)
150 – maximum permissible operating junction temperature, OC.
Rth j-a - thermal resistance junction ambient (for IC without heat sink), oC /W,
for ILE4275 without heat sink Rth ja is equal 80 oC /W
for ILE4275 without heat sink Rth ja is equal 65 oC /W
for IC with heat sink Rth ja is calculated by formula
Rth j-a = Rth j-c + Rth c-a
Rth j-c - thermal resistance junction case, oC /W. Rth jc = 4 oC/W.
Thermal resistance case-ambient Rth c-a is determined by heat sink design and is se-
lected by IC customer.
,
( 2 )
Application circuit and heat sink and ambient temperature have to provide junction tempera-
ture not more TJ 150 OC.
_________
* Ambient temperature is indicated.
January 2011, Ver.01
IKSEMICON [ IK SEMICON CO., LTD ]
