Intel® Embedded Flash Memory (J3 v. D)
(32, 64, and 128 Mbit)
Datasheet
Product Features
■
■
Architecture
— High-density symmetrical 128-Kbyte
blocks
—128 Mbit (128 blocks)
—64 Mbit (64 blocks)
—32 Mbit (32 blocks)
Performance
— 75 ns Initial Access Speed (128/64/32
-Mbit densities)
— 25 ns 8-word and 4-word
Asynchronous page-mode reads
— 32-Byte Write buffer
—4
μs
per Byte Effective
programming time
System Voltage and Power
— V
CC
= 2.7 V to 3.6 V
— V
CCQ
= 2.7 V to 3.6 V
■
■
Security
— Enhanced security options for code
protection
— 128-bit Protection Register
—64-bit Unique device identifier
—64-bit User-programmable OTP cells
— Absolute protection with V
PEN
= GND
— Individual block locking
— Block erase/program lockout during
power transitions
Software
— Program and erase suspend support
— Flash Data Integrator (FDI), Common
Flash Interface (CFI) Compatible
Quality and Reliability
— Operating temperature:
-40 °C to +85 °C
— 100K Minimum erase cycles per block
— 0.13
μm
ETOX™ VIII Process
Packaging
— 56-Lead TSOP package
— 64-Ball Intel
®
Easy BGA package
■
■
■
The Intel® Embedded Flash Memory J3 Version D (J3 v. D) provides improved mainstream performance
with enhanced security features, taking advantage of the high quality and reliability of the NOR-based Intel
0.13
μm
ETOX™ VIII process
technology. Offered in 128-Mbit (16-Mbyte), 64-Mbit, and 32-Mbit
densities, the J3 v. D device brings reliable, low-voltage capability (3 V read, program, and erase) with high
speed, low-power operation.
The J3 v. D device takes advantage of the proven manufacturing experience and is ideal for code and data
applications where high density and low cost are required, such as in networking, telecommunications,
digital set top boxes, audio recording, and digital imaging.
Intel Flash Memory components also deliver a new generation of forward-compatible software support. By
using the Common Flash Interface (CFI) and Scalable Command Set (SCS), customers can take advantage
of density upgrades and optimized write capabilities of future Intel® Flash Memory devices.
Notice:
This document contains information on new products in production. The specifications
are subject to change without notice. Verify with your local Intel sales office that you have the
latest datasheet before finalizing a design.
308551- 003
Feburary 2006
INTEL [ INTEL CORPORATION ]
