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335 参数 Datasheet PDF下载

335图片预览
型号: 335
PDF下载: 下载PDF文件 查看货源
内容描述: 赛扬D处理器 [Celeron D Processor]
分类和应用:
文件页数/大小: 82 页 / 1743 K
品牌: INTEL [ INTEL ]
 浏览型号335的Datasheet PDF文件第1页浏览型号335的Datasheet PDF文件第2页浏览型号335的Datasheet PDF文件第3页浏览型号335的Datasheet PDF文件第5页浏览型号335的Datasheet PDF文件第6页浏览型号335的Datasheet PDF文件第7页浏览型号335的Datasheet PDF文件第8页浏览型号335的Datasheet PDF文件第9页  
5.2.3 PROCHOT# Signal Pin..........................................................................66  
5.2.4 THERMTRIP# Signal Pin .......................................................................66  
5.2.5  
TCONTROL and Fan Speed Reduction (Optional) ...................................67  
5.2.6 Thermal Diode........................................................................................67  
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Features.......................................................................................................................69  
6.1  
6.2  
Power-On Configuration Options ........................................................................69  
Clock Control and Low Power States..................................................................69  
6.2.1 Normal State—State 1 ...........................................................................69  
6.2.2 AutoHALT Powerdown State—State 2 ..................................................70  
6.2.3 Stop-Grant State—State 3 .....................................................................71  
6.2.4 HALT/Grant Snoop State—State 4 ........................................................71  
6.2.5 Sleep State—State 5..............................................................................72  
Boxed Processor Specifications.......................................................................73  
7.1  
Mechanical Specifications...................................................................................74  
7.1.1 Boxed Processor Cooling Solution Dimensions.....................................74  
7.1.2 Boxed Processor Fan Heatsink Weight..................................................75  
7.1.3 Boxed Processor Retention Mechanism and Heatsink  
Attach Clip Assembly .............................................................................75  
Electrical Requirements ......................................................................................76  
7.2.1 Fan Heatsink Power Supply...................................................................76  
Thermal Specifications........................................................................................77  
7.3.1 Boxed Processor Cooling Requirements ...............................................77  
7.3.2 Variable Speed Fan ...............................................................................79  
7.2  
7.3  
8
Debug Tools Specifications.................................................................................81  
8.1  
Logic Analyzer Interface (LAI).............................................................................81  
8.1.1 Mechanical Considerations....................................................................81  
8.1.2 Electrical Considerations........................................................................81  
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Datasheet