欢迎访问ic37.com |
会员登录 免费注册
发布采购

DT28F016SA-100 参数 Datasheet PDF下载

DT28F016SA-100图片预览
型号: DT28F016SA-100
PDF下载: 下载PDF文件 查看货源
内容描述: 28F016SA 16兆位( 1兆比特×16 , 2兆×8 ) FlashFile记忆 [28F016SA 16-MBIT (1 MBIT X 16, 2 MBIT X 8)FlashFile MEMORY]
分类和应用:
文件页数/大小: 55 页 / 823 K
品牌: INTEL [ INTEL CORPORATION ]
 浏览型号DT28F016SA-100的Datasheet PDF文件第1页浏览型号DT28F016SA-100的Datasheet PDF文件第2页浏览型号DT28F016SA-100的Datasheet PDF文件第3页浏览型号DT28F016SA-100的Datasheet PDF文件第4页浏览型号DT28F016SA-100的Datasheet PDF文件第6页浏览型号DT28F016SA-100的Datasheet PDF文件第7页浏览型号DT28F016SA-100的Datasheet PDF文件第8页浏览型号DT28F016SA-100的Datasheet PDF文件第9页  
E
1.0
1.1
28F016SA
Internal algorithm automation allows word/byte
programs and block erase operations to be
executed using a two-write command sequence to
the CUI in the same way as the 28F008SA 8-Mbit
FlashFile memory.
A superset of commands have been added to the
basic 28F008SA command-set to achieve higher
program performance and provide additional
capabilities. These new commands and features
include:
Page Buffer Writes to Flash
Command Queueing Capability
Automatic Data Programs during Erase
Software Locking of Memory Blocks
Two-Byte
Systems
Successive
Programs
in
8-bit
INTRODUCTION
The documentation of the Intel 28F016SA memory
device includes this datasheet, a detailed user’s
manual, and a number of application notes, all of
which are referenced at the end of this datasheet.
The datasheet is intended to give an overview of the
chip feature-set and of the operating AC/DC
specifications.
The 16-Mbit Flash Product Family
User’s Manual
provides complete descriptions of
the user modes, system interface examples and
detailed descriptions of all principles of operation. It
also contains the full list of software algorithm
flowcharts, and a brief section on compatibility with
Intel 28F008SA.
Product Overview
The 28F016SA is a high-performance 16-Mbit
(16,777,216 bit) block erasable nonvolatile random
access memory organized as either 1 Mword x
16 or 2 Mbyte x 8. The 28F016SA includes thirty-
two 64-KB (65,536) blocks or thirty-two 32-KW
(32,768) blocks. A chip memory map is shown in
Figure 4.
The implementation of a new architecture, with
many enhanced features, will improve the device
operating characteristics and results in greater
product reliability and ease-of-use.
Among the
28F016SA:
significant
enhancements
on
the
Erase All Unlocked Blocks
Writing of memory data is performed in either byte
or word increments typically within 6 µs, a 33%
improvement over the 28F008SA. A block erase
operation erases one of the 32 blocks in typically
0.6 sec, independent of the other blocks, which is a
65% improvement over the 28F008SA.
Each block can be written and erased a minimum of
100,000 cycles. Systems can achieve typically one-
million block erase cycles by providing wear-leveling
algorithms and graceful block retirement. These
techniques have already been employed in many
flash file systems. Additionally, wear leveling of
block erase cycles can be used to minimize the
program/erase performance differences across
blocks.
The 28F016SA incorporates two Page Buffers of
256 bytes (128 words) each to allow page data
writes. This feature can improve a system write
performance by up to 4.8 times over previous flash
memory devices.
All operations are started by a sequence of
command writes to the device. Three Status
Registers (described in detail later) and a RY/BY#
output pin provide information on the progress of
the requested operation.
While the 28F008SA requires an operation to
complete before the next operation can be
requested, the 28F016SA allows queueing of the
next operation while the memory executes the
current operation. This eliminates system overhead
5
3.3V Low Power Capability
Improved Program Performance
Dedicated Block Program/Erase Protection
A 3/5# input pin reconfigures the device internally
for optimized 3.3V or 5.0V read/program operation.
The 28F016SA will be available in a 56-lead,
1.2 mm thick, 14 mm x 20 mm TSOP type I
package or a 56-lead, 1.8 mm thick, 16 mm x
23.7 mm SSOP package. The TSOP form factor
and pinout allow for very high board layout
densities. SSOP packaging provides relaxed lead
spacing dimensions.
A Command User Interface (CUI) serves as the
system interface between the microprocessor or
microcontroller and the internal memory operation.