1-Gbit P30 Family
3.2
64-Ball Easy BGA Package
Figure 2.
Easy BGA Mechanical Specifications
Ball A1
Corner
Ball A1
Corner
D
S1
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
S2
A
B
C
D
E
A
B
C
D
E
F
b
e
E
F
G
G
H
H
Top View - Ball side down
A1
Bottom View - Ball Side Up
A2
A
Seating
Plane
Y
Note: Drawing not to scale
Table 2.
Easy BGA Package Dimensions
Millimeters
Nom
Inches
Symbol
Notes
Product Information
Min
Max
Min
Nom
Max
Package Height (64/128/256-Mbit)
Package Height (512-Mbit)
Ball Height (64/128/256-Mbit)
Ball Height (512-Mbit)
A
A
-
-
-
1.200
-
-
0.0472
-
1.300
-
-
0.0512
A1
A1
A2
A2
b
0.250
-
-
0.0098
-
-
0.240
-
-
-
0.0094
-
-
Package Body Thickness (64/128/256-Mbit)
Package Body Thickness (512-Mbit)
Ball (Lead) Width
-
0.780
0.910
0.430
10.000
13.000
1.000
64
-
0.0307
0.0358
0.0169
0.3937
0.5118
0.0394
64
-
-
0.330
9.900
12.900
-
-
-
-
0.530
10.100
13.100
-
0.0130
0.3898
0.5079
-
0.0209
0.3976
0.5157
-
Package Body Width
D
1
1
Package Body Length
E
Pitch
[e]
N
Ball (Lead) Count
-
-
-
-
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
Y
-
-
0.100
1.600
3.100
-
-
0.0039
0.0630
0.1220
S1
S2
1.400
2.900
1.500
3.000
0.0551
0.1142
0.0591
0.1181
1
1
Note: Daisy Chain Evaluation Unit information is at Intel® Flash Memory Packaging Technology http://developer.intel.com/
design/flash/packtech.
April 2005
12
Intel StrataFlash® Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
INTEL [ INTEL ]
