3 Volt Intel® Advanced+ Boot Block Flash Memory Stacked-CSP Family
Table 31. Packaging Specifications (0.18µm and 0.25µm)
Millimeters
Inches
Nom
Sym
Min
Nom
Max
Min
Max
Package Height
A
A1
A2
b
1. 400
0.0551
Ball Height
0.250
0.0098
Package Body Thickness
Ball Lead Diameter
0.960
0.400
10.00
0.0378
0.0157
0.3937
0.350
9.900
0.450
0.0138
0.3898
0.0177
0.3976
Package Body Length – 16-Mbit/2-Mbit
10.100
Package Body Length –
11.900
13.900
12.000
14.000
12.100
14.100
0.4685
0.5472
0.4724
0.5512
0.4764
0.5551
32-Mbit/4-Mbit, 16-Mbit/4-Mbit
D
Package Body Length –
32-Mbit/8-Mbit
Package Body Width –
16-Mbit/2-Mbit, 16-Mbit/4-Mbit,
32-Mbit/4-Mbit, 32-Mbit/8-Mbit
E
7.900
8.000
8.100
0.3110
0.3150
0.3189
Pitch
e
N
Y
0.800
66
0.0315
66
Ball (Lead) Count
Seating Plane Coplanarity
0.100
1.300
0.0039
0.0512
Corner to Ball A1 Distance Along E
S1
1.100
1.200
0.0433
0.0472
16-Mbit/2-Mbit, 16-Mbit/4-Mbit,
32-Mbit/4-Mbit, 32-Mbit/8-Mbit
Corner to Ball A1 Distance Along D
16-Mbit/2-Mbit
0.500
1.500
2.500
0.600
1.600
2.600
0.700
1.700
2.700
0.0197
0.0591
0.0984
0.0236
0.0630
0.1024
0.0276
0.0669
0.1063
Corner to Ball A1 Distance Along D
32-Mbit/4-Mbit, 16-Mbit/4-Mbit
S2
Corner to Ball A1 Distance Along D
32-Mbit/8-Mbit
Datasheet
65
INTEL [ INTEL ]
