82566 Gigabit Platform LAN Connect
Networking Silicon
Datasheet
Product Features
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IEEE 802.3ab compliant
— Robust operation over the installed base
of Category-5 (Cat-5) twisted pair
cabling
Robust end to end connections over various
cable lengths
Full duplex at 10, 100, or 1000 Mbps and
half duplex at 10 or 100 Mbps.
IEEE 802.3ab Auto-negotiation with Next
Page support
— Automatic link configuration including
speed, duplex, and flow control
10/100 downshift
— Automatic link speed adjustment with
poor quality cable
Automatic MDI crossover
— Helps to correct for infrastructure issues
Advanced Cable Diagnostics
— Improved end-user troubleshooting
Footprint compatible with 82562V devices
for a single-board dual design (Gigabit and
10/100)
LCI interface for a very low power 10/100
link
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Gigabit LAN Connect Interface
— Low pin count, high speed interface
with special low power idle modes
— Allows PHY placement proximity to I/O
back panel.
3 LED outputs
— Link and Activity indications (10, 100,
and 1000 Mbps)
Clock supplied to MAC
— Cost optimized design
Full chip power down
— Support for lowest power state
81-pin, 1.0 mm pitch, 10 mm x 10 mm
FCMMAP (BGA) Package
— Smaller footprint and lower power
dissipation compared to multi-chip
MAC and PHY solutions. Footprint
compatible with the Intel
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82562V
Platform LAN Connect device
Integrated voltage regulator and power
supply control, which can be powered from
a single 3.3V DC rail
Operating temperatures: 0° C to 70° C and
0° C to 55° C (with internal regulator) –
heat sink or forced airflow not required
— Simple Thermal Design
Power Consumption less than 1.16 Watts
(silicon power)
317436-003
Revision 2.4
INTEL [ INTEL CORPORATION ]
