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PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
BYTE-WIDE
8-MBIT (1024K x 8), 16-MBIT (2056K x 8)
FLASH MEMORY FAMILY
28F008B3, 28F016B3
Flexible SmartVoltage Technology
2.7V–3.6V Program/Erase
2.7V–3.6V Read Operation
12V V
PP
Fast Production
Programming
2.7V or 1.8V I/O Option
Reduces Overall System Power
Optimized Block Sizes
Eight 8-Kbyte Blocks for Data,
Top or Bottom Locations
Up to Thirty-One 64-Kbyte Blocks
for Code
High Performance
2.7V–3.6V: 120 ns Max Access Time
Block Locking
V
CC
-Level Control through WP#
Low Power Consumption
20 mA Maximum Read Current
Absolute Hardware-Protection
V
PP
= GND Option
V
CC
Lockout Voltage
Extended Temperature Operation
–40°C to +85°C
Supports Code plus Data Storage
Optimized for FDI, Flash Data
Integrator Software
Fast Program Suspend Capability
Fast Erase Suspend Capability
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Extended Cycling Capability
10,000 Block Erase Cycles
Automated Byte Program and Block
Erase
Command User Interface
Status Registers
SRAM-Compatible Write Interface
Automatic Power Savings Feature
Reset/Deep Power-Down
1 µA I
CC
Typical
Spurious Write Lockout
Standard Surface Mount Packaging
48-Ball
µBGA*
Package
40-Lead TSOP Package
Footprint Upgradeable
Upgradeable from 2-, 4- and 8-Mbit
Boot Block
ETOX™ V (0.4
µ)
Flash Technology
x8-Only Input/Output Architecture
For Space-Constrained 8-bit
Applications
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The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide
products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp
May 1997
Order Number: 290605-001
INTEL [ INTEL CORPORATION ]
