8XC251SA/SB/SP/SQ HIGH-PERFORMANCE CHMOS MICROCONTROLLER
1.0
NOMENCLATURE
X
m
Te
XX
c
Pa
8
X
o
Pr
X
o
Pr
XXXXX
XX
ed
pe
eS
vic
De
ily
am
tF
uc
n
od
t io
Pr
s
ma
on
or
pti
I nf
yO
ss
or
ce
em
-m
am
gr
g
gin
ka
Figure 2. The 8XC251SA/SB/SP/SQ Family Nomenclature
Table 1. Description of Product Nomenclature
Parameter
Temperature and Burn-in
Options
Options
no mark
T
Packaging Options
N
P
C
Program Memory Options
0
3
7
Process Information
Product Family
Device Memory Options
C
251
SA
SB
SP
SQ
Device Speed
16
Description
Commercial operating temperature range (0°C to 70°C) with
Intel standard burn-in.
Express operating temperature range (-40°C to 85°C) with
Intel standard burn-in.
44-pin Plastic Leaded Chip Carrier (PLCC)
40-pin Plastic Dual In-line Package (PDIP)
40-pin Ceramic Dual In-line Package (Ceramic DIP)
Without ROM/OTPROM/EPROM
ROM
User programmable OTPROM/EPROM
CHMOS
8-bit control architecture
1-Kbyte RAM/8-Kbyte ROM/OTPROM/EPROM
1-Kbyte RAM/16-Kbyte ROM/OTPROM/EPROM or without
ROM/OTPROM/EPROM
512-byte RAM/8-Kbyte ROM/OTPROM/EPROM
512-byte RAM/16-Kbyte ROM/OTPROM/EPROM or without
ROM/OTPROM/EPROM
External clock frequency
pe
tu
ra
re
an
ns
tio
ns
Op
tio
in
Op
n-
ur
dB
A2815-01
4
PRELIMINARY
INTEL [ INTEL CORPORATION ]
