BOND PAD CONFIGURATION
Important remarks:
The epitaxial layer is not connected to the Vs+ pin on the
die, this is to allow temperature measurement with the
diode. The epi contact and the cathode of the diode have
the same electrical potential. To avoid bias effects, diode
and bridge cannot be used simultaneously.
As the sensing elements are diffused resistances, the
voltage applied on the ground pads (GND) and on the
supply voltage (Vs+) have to be lower or equal than the
voltage applied on the epi contact (EPI). For better stability it
is good to define the potential of the EPI.
Gold ball bonding or aluminum wedge bonding can be used
to wire-bond the sensor. The quality of the wire-bonding is
equipment and process dependant. For this reason, it is
strongly recommended that a thorough wire-bonding
qualification is made by the end user if the sensor is going
to be operated over an extended temperature range.
LAYOUT
DA7212-A2_001.doc
007212A21149
ECN 1175
April 24, 2009
2/5
INTERSEMA [ INTERSEMA SENSORIC SA ]
