HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Ordering Information
(Continued)
PART NO.
HIN208EIAZ
(Note)
HIN208EIAZ-T
(Note)
HIN208EIB
HIN208EIBZ
(Note)
HIN211ECA
HIN211ECA-T
HIN211ECAZ
(Note)
HIN211ECAZ-T
(Note)
HIN211ECB
HIN211ECBZ
(Note)
HIN211ECBZ-T
(Note)
HIN211EIA
HIN211EIA-T
HIN211EIAZ
(Note)
HIN211EIAZ-T
(Note)
HIN211EIB
HIN211EIBZ
(Note)
HIN213ECA
HIN213ECA-T
HIN213ECAZ
(Note)
HIN213ECAZ-T
(Note)
HIN213EIA
HIN213EIA-T
HIN213EIAZ
(Note)
HIN213EIAZ-T
(Note)
HIN213EIB
HIN213EIBZ
(Note)
PART
MARKING
HIN208EIAZ
HIN208EIAZ
HIN208EIB
HIN208EIBZ
HIN211ECA
HIN211ECA
HIN211ECAZ
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
M24.209
M24.209
M24.3
M24.3
M28.209
M28.209
M28.209
M28.209
M28.3
M28.3
M28.3
M28.209
M28.209
M28.209
M28.209
M28.3
M28.3
M28.209
M28.209
M28.209
M28.209
M28.209
M28.209
M28.209
M28.209
M28.3
M28.3
HIN232EIBNZ
(Note)
HIN232ECBNZ
(Note)
HIN232ECBN
HIN232ECBN-T
HIN232ECAZ-T
(Note)
HIN232ECB
HIN232ECB-T
Ordering Information
(Continued)
PART NO.
HIN232ECA
HIN232ECA-T
PART
MARKING
HIN232ECA
HIN232ECA
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
M16.209
M16.209
M16.209
-40 to 85 24 Ld SSOP
(Pb-free)
24 Ld SSOP Tape and
Reel (Pb-free)
-40 to 85 24 Ld SOIC
-40 to 85 24 Ld SOIC
(Pb-free)
0 to 70 28 Ld SSOP
28 Ld SSOP Tape and
Reel
0 to 70 28 Ld SSOP
(Pb-free)
0 to 70 16 Ld SSOP
16 Ld SSOP Tape and
Reel
HIN232ECAZ 16 Ld SSOP Tape and
Reel (Pb-free)
HIN232ECB
HIN232ECB
0 to 70 16 Ld SOIC (W) M16.3
16 Ld SOIC (W) Tape and M16.3
Reel
HIN232ECBN 0 to 70 16 Ld SOIC (N) M16.15
HIN232ECBN 16 Ld SOIC (N) Tape and M16.15
Reel
232ECBNZ
0 to 70 16 Ld SOIC (N) M16.15
(Pb-free)
16 Ld SOIC (N) Tape and M16.15
Reel (Pb-free)
0 to 70 16 Ld SOIC (W) M16.3
(Pb-free)
16 Ld SOIC (W) Tape and M16.3
Reel (Pb-free)
0 to 70 16 Ld PDIP
0 to 70 16 Ld PDIP*
(Pb-free)
E16.3
E16.3
HIN211ECAZ 28 Ld SSOP Tape and
Reel (Pb-free)
HIN211ECB
HIN211ECBZ
0 to 70 28 Ld SOIC
0 to 70 28 Ld SOIC
(Pb-free)
HIN232ECBNZ-T 232ECBNZ
(Note)
HIN232ECBZ
(Note)
HIN232ECBZ-T
(Note)
HIN232ECP
HIN232ECPZ
(Note)
HIN232EIBN
HIN232EIBN-T
232ECBZ
232ECBZ
HIN232ECP
HIN232ECPZ
HIN211ECBZ 28 Ld SOIC Tape and
Reel (Pb-free)
HIN211EIA
HIN211EIA
HIN211EIAZ
HIN211EIAZ
HIN211EIB
HIN211EIBZ
HIN213ECA
HIN213ECA
HIN213ECAZ
-40 to 85 28 Ld SSOP
28 Ld SSOP Tape and
Reel
-40 to 85 28 Ld SSOP
(Pb-free)
28 Ld SSOP Tape and
Reel (Pb-free)
-40 to 85 28 Ld SOIC
-40 to 85 28 Ld SOIC
(Pb-free)
0 to 70 28 Ld SSOP
28 Ld SSOP Tape and
Reel
0 to 70 28 Ld SSOP
(Pb-free)
HIN232EIBN -40 to 85 16 Ld SOIC (N) M16.15
HIN232EIBN 16 Ld SOIC (N) Tape and M16.15
Reel
232EIBNZ
-40 to 85 16 Ld SOIC (N) M16.15
(Pb-free)
16 Ld SOIC (N) Tape and M16.15
Reel (Pb-free)
-40 to 85 16 Ld TSSOP
16 Ld TSSOP Tape and
Reel
-40 to 85 16 Ld TSSOP
(Pb-free)
16 Ld TSSOP Tape and
Reel (Pb-free)
M16.173
M16.173
M16.173
M16.173
HIN232EIBNZ-T 232EIBNZ
(Note)
HIN232EIV
HIN232EIV-T
HIN232EIVZ
(Note)
HIN232EIVZ-T
(Note)
HIN232EIV
HIN232EIV
232EIVZ
232EIVZ
HIN213ECAZ 28 Ld SSOP Tape and
Reel (Pb-free)
HIN213EIA
HIN213EIA
HIN213EIAZ
HIN213EIAZ
HIN213EIB
HIN213EIBZ
-40 to 85 28 Ld SSOP
28 Ld SSOP Tape and
Reel
-40 to 85 28 Ld SSOP
(Pb-free)
28 Ld SSOP Tape and
Reel (Pb-free)
-40 to 85 28 Ld SOIC
-40 to 85 28 Ld SOIC
(Pb-free)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
3
FN4315.16
November 4, 2005
INTERSIL [ INTERSIL CORPORATION ]
