HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
H
E
-B-
1
2
3
SEATING PLANE
-A-
D
-C-
A
h x 45
o
0.25(0.010) M
B M
M16.15
(JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES
SYMBOL
A
A1
B
MIN
0.053
0.004
0.014
0.007
0.386
0.150
MAX
0.069
0.010
0.019
0.010
0.394
0.157
MILLIMETERS
MIN
1.35
0.10
0.35
0.19
9.80
3.80
MAX
1.75
0.25
0.49
0.25
10.00
4.00
NOTES
-
-
9
-
3
4
-
-
5
6
7
8
o
-
Rev. 1 02/02
L
C
D
E
e
H
h
C
0.050 BSC
0.228
0.010
0.016
16
0
o
8
o
0.244
0.020
0.050
1.27 BSC
5.80
0.25
0.40
16
0
o
6.20
0.50
1.27
e
B
0.25(0.010) M
C A M
B S
α
µ
A1
0.10(0.004)
L
N
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
13
INTERSIL [ INTERSIL CORPORATION ]
