CA158, CA158A, CA258, CA258A, CA358, CA358A, CA2904, LM358, LM2904
Typical Performance Curves
(Continued)
70
V+ = 15V
OUTPUT SOURCE CURRENT (mA)
60
50
40
30
20
10
0
-75
-50
-25
0
25
50
75
100
125
TEMPERATURE (
o
C)
FIGURE 13. OUTPUT CURRENT vs AMBIENT TEMPERATURE
Metallization Mask Layout
0
72
70
60
50
40
30
20
10
0
69 - 77
(1.753 - 1.956)
10
20
30
40
50
60 66
4 - 10
(0.102 - 0.254)
63 - 71
(1.600 - 1.803)
Dimensions in parentheses are in millimeters and derived
from the basic inch dimensions as indicated. Grid gradua-
tions are in mils (10
-3
inch).
The photographs and dimensions represent a chip when it
is part of the wafer. When the wafer is cut into chips, the
cleavage angles are 57
o
instead of 90
o
with respect to the
face of the chip. Therefore, the isolated chip is actually
7mils (0.17mm) larger in both dimensions.
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
7
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