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CHP2-100-2203-C-BLK-LF 参数 Datasheet PDF下载

CHP2-100-2203-C-BLK-LF图片预览
型号: CHP2-100-2203-C-BLK-LF
PDF下载: 下载PDF文件 查看货源
内容描述: 金属釉™圆柱表面贴装功率电阻 [Metal Glaze™ Cylindrical Surface Mount Power Resistors]
分类和应用:
文件页数/大小: 3 页 / 146 K
品牌: IRCTT [ IRC - A TT ELECTRONICS COMPANY. ]
 浏览型号CHP2-100-2203-C-BLK-LF的Datasheet PDF文件第2页浏览型号CHP2-100-2203-C-BLK-LF的Datasheet PDF文件第3页  
Metal Glaze™ Cylindrical
Surface Mount
Power Resistors
CHP Series
Up to 2 watts
Up to 1000 volts
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
Solder over nickel
barrier
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
1206
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
0.2 to 0.99
500
1000
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See page 8 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Maximum Change
As specified
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.5% + 0.01 ohm
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
CHP Series Issue July 2009 Sheet 1 of 3
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
for 5 seconds
MIL-R-55342E Par 4.7.6 (-150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)
1200 gram push from underside of mounted cchip for 60 seconds
Chip mounted in center of 90mm long board, deflected 1mm so as to
exert pull on chip contacts for 5 seconds
© IRC Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com