Surface Mount
Resistor
Physical Data
Planar Terminations
C
C
Wrap
Around
Terminations
(3 Faces)
T
A
Res
ist
On T or
op
Face
Res
istor
On T
op
Face
T
B
L
L
W
A
W
Dimensions (Inches and (mm))
Style
0805
1206
L
.079 ± .012
(2.0 ± 0.3)
.126 ± .016
(3.2 ± 0.4)
W
.049 ± .008
(1.25 ± 0.2)
.063 ± .008
(1.6 ± 0.2)
T
.027
(.07)
.027
(.07)
Wrap-around
A
.012 ± .006
(0.3 ± 0.15)
.016 ± .008
(0.4 ± 0.2)
B*
.035
(0.9min)
.067
(1.7min)
Planar
C
.012 ± .004
(0.3 ± 0.1)
.016 ± .006
(0.4 ± 0.15)
Weight (g)
0.009
0.020
* This dimension determines the number of conductors which may pass under the surface mounted device.
APPLICATION NOTES:
Mounting
This chip resistor is ideally suited for handling by automatic methods due to its rectangular shape and the small dimensional tolerances. Electri-
cal connection to a ceramic substrate or to a printed circuit board can be made by reflow soldering of wrap-around terminations (e.g. suffix ‘F’ in
CR0805F). The ‘F’ terminations provide good leach properties and ensure reliable contact. Due to the robust construction, the resistor chip can
be immersed completely in the solder bath for 30 seconds at 260°C. This enables the resistor to be mounted on one side of a printed circuit board
and other wire-leaded components on the other side.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
CR Series Issue March 2009 Sheet 2 of 3
IRCTT [ IRC - A TT ELECTRONICS COMPANY. ]
