63.5mm 2.500"
1
Substrate: 1.59mm ±0.18m m [0.0625" ±0.007"] FR4/G10 or
equivale nt high temp material. 17µm [1/2 oz.] Cu clad. SnPb
plating.
Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm
[10µ"] Au over 1.27µm [50µ"] Ni (min.).
Test points: ma terial- Phosphor Bronz e; plating- Sn ove r
1.27µm [ 50µ"] Ni. Gold flash on contact end.
2
3
48.26mm
1.900"
Y
1mm
Top View
1
X
Leadless foot dimensions
2
19.68mm
0.775"
B
MGA socket
3
1mm
7.24mm [0.285"] Assembled
Leadless foot
A
Side View
QFP package dimensions
* Part Number
CA-QFE64RA-L-Z-T-01
CA-QFE64RB-L-Z-T-01
CA-QFE64RC-L-Z-T-01
CA-QFE64RD-L-Z-T-01
Footprint
QFE64RA
QFE64RB
QFE64RC
QFE64RD
Dim "A"
19.6mm [0.772"]
17.2mm [0.677"]
17.9mm [0.705"]
18.8mm [0.740"]
Dim "B"
Dim "X"
Dim "Y"
25.5 mm [1.004"] 17.65mm [0.695"] 23.62mm [0.930"]
23.2mm [0.913"]
23.9mm [0.941"]
24.8mm [0.976"]
16.13mm [0.635"] 22.10mm [0.870"]
16.89mm [0.665"] 22.86mm [0.900"]
17.65mm [0.695"] 23.62mm [0.930"]
Description: Carrier Adaptor (CA)
64 position (1.00mm pitch) QFP zero insertion force (ZIF) socket with test points to 64 position surface mountable QFP emulator foot. The 2
piece adaptor interconnects via a gold plated (1.27mm [0.05"] center) Mini-grid socket interface. Emulator foot is leadless and design to attached
to gull-wing QFP pattern.
Tolera nce s: diameters ± 0.0 3mm [±0.001”], P CB pe rimete rs ±0.13mm [±0 .0 05”], PCB th icknesses ±0 .18 mm [±0.007"], p itches (from true position) ±0.08mm [±0 .0 03"], all
other toleran ce s ±0.13mm [±0 .00 5”] un less stated otherwise.
CA-QFE64R(x)-L-Z-T-01* Drawing
© 1995 IRO NWO OD ELECTRO NICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics .c om
Status: Released
Drawing: G. Nelson
Scale 3:2
Rev: G
Date: 3/23/95
Modified: 1/28/05, MT
File: CA-QFE064RA-L-Z-T-01 Dwg
IRONWOOD [ IRONWOOD ELECTRONICS. ]
