HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Absolute Maximum Ratings
Thermal Information
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
< 6V
Thermal Resistance (Typical, Note 3)
θ
( C/W)
CC
V+ to Ground (Note 2) . . . . . . . . . . . . . . . (V
CC
-0.3V) < V+ < 13.2V
JA
CC
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
90
70
100
75
70
95
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)
IN
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
IN
Output Voltages
80
o
T
R
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
< (V+ +0.3V)
< (V+ +0.3V)
OUT
TXOUT
RXOUT
Maximum Junction Temperature (Plastic Package) . . . . . . . .150 C
o
o
OUT
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C
o
Short Circuit Duration
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
OUT
(SOIC, SSOP, MQFP - Lead Tips Only)
OUT
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C
o
o
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.
3. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V = +5V ±10%, T = Operating Temperature Range
CC
A
PARAMETER
SUPPLY CURRENTS
Power Supply Current, I
TEST CONDITIONS
MIN
TYP
MAX
UNITS
No Load,
o
HIN232
-
-
-
-
5
10
15
1
mA
mA
mA
mA
CC
T = 25 C
A
HIN236-HIN238, HIN240-HIN241
7
HIN239
HIN239
0.4
5.0
V+ Power Supply Current, I
No Load,
o
15
CC
o
No Load, T = 25 C
T = 25 C
A
A
o
Shutdown Supply Current, I (SD)
CC
T = 25 C
-
1
10
µA
A
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
T
T
, EN, Shutdown
-
-
-
0.8
-
V
V
lL
IN
IN
Input Logic High, V
2.0
2.4
-
lH
EN, Shutdown
= 0V
-
-
V
Transmitter Input Pullup Current, I
T
15
0.1
4.6
200
0.4
-
µA
V
P
IN
TTL/CMOS Receiver Output Voltage Low, V
I
I
= 1.6mA
= -1.0mA
-
OL
OUT
OUT
TTL/CMOS Receiver Output Voltage High, V
3.5
V
OH
RECEIVER INPUTS
RS-232 Input Voltage Range V
-30
3.0
0.8
-
-
+30
7.0
-
V
kΩ
V
IN
Receiver Input Impedance R
V
V
V
= ±3V
5.0
1.2
1.7
0.5
IN
IN
o
Receiver Input Low Threshold, V (H-L)
= 5V, T = 25 C
A
lN
Receiver Input High Threshold, V (L-H)
CC
CC
o
= 5V, T = 25 C
2.4
1.0
V
IN
A
Receiver Input Hysteresis V
0.2
V
HYST
8
ISSI [ INTEGRATED SILICON SOLUTION, INC ]
