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IS42S32200E-7BLI 参数 Datasheet PDF下载

IS42S32200E-7BLI图片预览
型号: IS42S32200E-7BLI
PDF下载: 下载PDF文件 查看货源
内容描述: 512K位×32位×4 ,银行(64 - MBIT )同步动态RAM [512K Bits x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM]
分类和应用: 存储内存集成电路动态存储器时钟
文件页数/大小: 59 页 / 919 K
品牌: ISSI [ INTEGRATED SILICON SOLUTION, INC ]
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IS42S32200E
IS45S32200E
512K Bits x 32 Bits x 4 Banks (64-MBIT)
SYNCHRONOUS DYNAMIC RAM
FEATURES
• Clock frequency: 200, 166, 143, 133 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Single 3.3V power supply
• LVTTL interface
• Programmable burst length:
(1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Self refresh modes
• 4096 refresh cycles every 16ms (A2 grade) or
64ms (Commercia, Industrial, A1 grade)
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
AUGUST 2009
organized as 524,288 bits x 32-bit x 4-bank for improved
performance. The synchronous DRAMs achieve high-
speed data transfer using pipeline architecture. All inputs
and outputs signals refer to the rising edge of the clock
input.
OVERVIEW
ISSI
's 64Mb Synchronous DRAM IS42/45S32200E is
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
Clk Frequency
CAS Latency = 3
CAS Latency = 2
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
-5
-6
-7
7
10
143
100
5.5
8
-75E
7.5
133
5.5
Unit
ns
ns
Mhz
Mhz
ns
ns
5
6
10 10
200 166
100 100
5 5.5
8
8
OPTIONS
• Packages:
86-pin TSOP-II
90-ball TF-BGA
• Operating temperature range:
Commercial (0
o
C to + 70
o
C)
Industrial (-40
o
C to + 85
o
C)
Automotive Grade, A1 (-40
o
C to + 85
o
C)
Automotive Grade, A2: (-40
o
C to +105
o
C)
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. B
07/23/09
1